VANCOUVER, Wash.--(BUSINESS WIRE)--Kyocera Industrial Ceramics Corporation, Chemical Sales Division today announced the introduction of its new environmentally friendly XKE-G5633 Epoxy Molding ...

When engineers at General Dynamics Armament and Technical Products (GDATP) recently designed the ammunition container for a new aircraft weapon system, they decided very early in the process to make ...

Today’s fan-out wafer-level packaging (FOWLP) processes use organic substrates composed of epoxy mold compound (EMC) created using a thermal compression process. EMC wafers are a cost-effective way to ...

The global supply of epoxy molding compound for backend applications has fallen short of demand by 20% with delivery lead times extended further, according to industry sources. Sumitomo Bakelite, now ...

We test the structural integrity of metal epoxy by casting it into a mold to see if it can maintain a razor-sharp edge for practical use.

System-in-Package (SiP) technology has been used for a wide range of electronic devices, but the warpage behavior of the package can be difficult to control and predict due to complex manufacturing ...

The space industry is growing. According to a January 2023 McKinsey report, the number of small satellites launched per year will ramp from 1,740 in 2022 to more than 3,000 in 2030, and space ...

Key semiconductor material distributor Chang Wah Electromaterials (CWE) has announced new pricing for epoxy molding compounds effective from the third quarter of 2024, due to a weak Japanese Yen. Some ...