FREMONT, Calif., Feb. 09, 2022 (GLOBE NEWSWIRE) -- Lam Research Corp. (NASDAQ: LRCX) today announced a new suite of selective etch products that apply breakthrough wafer fabrication techniques and ...
Breakthrough EUV Dry Photoresist Technology from Lam Research Adopted by Leading Memory Manufacturer
FREMONT, Calif., Jan. 29, 2025 /PRNewswire/ -- Lam Research Corporation (LRCX) (Nasdaq: LRCX) today announced that Aether®, its innovative dry photoresist technology, has been selected by a leading ...
Lam Research has introduced Dextro, which the company claims is the semiconductor industry's first collaborative robot (cobot) designed to optimize critical maintenance tasks on wafer fabrication ...
A new inter-die gapfill tool is purpose-built to solve critical challenges in 3D stacking and high-density heterogeneous integration. VECTOR TEOS 3D provides ultra-thick, uniform inter-die gapfill by ...
New Portfolio Leapfrogs the Competition with Innovative Etch Techniques and Chemistries to Support Development of Advanced Logic and Memory Solutions As modern technologies and devices continue to ...
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